Fast and simple fabrication procedure of whole-glass microfluidic devices with metal electrodes

被引:9
作者
Kotowski, Jaroslav [1 ]
Navratil, Vit [1 ]
Slouka, Zdenek [2 ]
Snita, Dalimil [3 ]
机构
[1] Prague Inst Chem Technol, Dept Chem Engn, CR-16628 Prague, Czech Republic
[2] Univ Notre Dame, Notre Dame, IN 46556 USA
[3] Univ W Bohemia, Res Ctr New Technol, Plzen 30614, Czech Republic
关键词
Microfluidic system; Glass chip; Integrated electrodes; Micro-device; Fabrication; LOW-TEMPERATURE; HIGH-PRESSURE; CHIP; GRADIENT;
D O I
10.1016/j.mee.2013.03.123
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We developed a new process for fabrication of whole-glass microfluidic chips with integrated metal electrode arrays. Our process. is based on a novel technique that enables reliable bonding of two glass substrates, one with a microfluidic channel and the other with an electrode array. The technique uses sodium silicate as an intermediate layer between the two glass substrates; this layer provides very tight bonding while preserving full functionality of the metal electrodes. Functionality of the electrode array was confirmed by impedance spectroscopy measurements of KCl solutions with different concentrations. To confirm the quality of bonding, we used a solution of fluorescein as a tracer of any poorly bonded areas. Our results showed that there was no fluorescein leakage out of the microfluidic channel and that the electrodes were free of sodium silicate where desired. Our method can be applied to fast and cost-effective prototyping of whole-glass microfluidic chips with integrated electrode arrays. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:441 / 445
页数:5
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