Electrical and physical analysis of MoTa alloy for gate electrode applications

被引:14
作者
Chen, B [1 ]
Biswas, N [1 ]
Misra, V [1 ]
机构
[1] N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA
关键词
Molybdenum alloys;
D O I
10.1149/1.2180710
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This article presents MoxTay as a potential candidate for dual metal complementary metal oxide semiconductor (CMOS) applications. The electrical characterization results of MoTa alloy indicates that the effective work function can be controlled to around 4.3 eV on SiO2 and is suitable for n-type MOS gate electrode application. The MoTa alloy forms a solid solution instead of an intermetallic compound. We report that the MoTa solid solution can achieve low work function values and is stable up to 900 C. X-ray diffraction results indicated only a single MoTa alloy phase. X-ray photoelectron spectroscopy analysis confirmed that no Mo-Ta compound bonding formed within the MoTa alloy. Moreover, from Auger electron spectroscopy and Rutherford backscattering spectroscopy analysis, MoTa was found to be stable on SiO2 under high-temperature anneals and no metal diffusion into substrate Si channel was detected. This indicates that MoxTay is a good candidate for CMOS metal gate applications. (c) 2006 The Electrochemical Society. [DOI: 10.1149/ 1.2180710] All rights reserved.
引用
收藏
页码:G417 / G419
页数:3
相关论文
共 12 条
[1]   Reliability and integration of ultra-thin gate dielectrics for advanced CMOS [J].
Buchanan, DA ;
Lo, SH .
MICROELECTRONIC ENGINEERING, 1997, 36 (1-4) :13-20
[2]   Physical and electrical analysis of RuxYy alloys for gate electrode applications -: art. no. 053502 [J].
Chen, B ;
Suh, Y ;
Lee, J ;
Gurganus, J ;
Misra, V ;
Cabral, C .
APPLIED PHYSICS LETTERS, 2005, 86 (05) :1-3
[3]   THEORETICAL DETERMINATIONS OF THERMODYNAMIC DATA AND PHASE-DIAGRAMS OF BCC BINARY TRANSITION-METAL ALLOYS [J].
COLINET, C ;
BESSOUD, A ;
PASTUREL, A .
JOURNAL OF PHYSICS F-METAL PHYSICS, 1988, 18 (05) :903-921
[4]   Impact of gate workfunction on device performance at the 50 nm technology node [J].
De, I ;
Johri, D ;
Srivastava, A ;
Osburn, CM .
SOLID-STATE ELECTRONICS, 2000, 44 (06) :1077-1080
[5]  
HAUSER JR, 1997, SRC WORKING PAPER
[6]  
Hobbs C., 2003, 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407), P9, DOI 10.1109/VLSIT.2003.1221060
[7]   Evaluation of fermi level pinning in low, midgap and high workfunction metal gate electrodes on ALD and MOCVD HfO2 under high temperature exposure [J].
Jha, R ;
Lee, JH ;
Chen, B ;
Lazar, H ;
Gurganus, J ;
Biswas, N ;
Majhi, P ;
Brown, G ;
Misra, V .
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, :295-298
[8]   Properties of Ta-Mo alloy gate electrode for n-MOSFET [J].
Lee, CK ;
Kim, JY ;
Hong, SN ;
Zhong, HC ;
Chen, B ;
Misra, V .
JOURNAL OF MATERIALS SCIENCE, 2005, 40 (9-10) :2693-2695
[9]  
Predmore R., 1970, Scripta Metallurgica, V4, P213, DOI 10.1016/0036-9748(70)90195-X
[10]  
Ranade P, 2002, INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, P363, DOI 10.1109/IEDM.2002.1175853