Simulation, design and fabrication of a planar micro thermoelectric generator

This study describes the design, simulation, and micro fabrication of a micro thermoelectric generator (mu TEG) based on planar technology using constantan (CuNi) and copper (Cu) thermocouples deposited electrochemically (ECD) on silicon substrate. The present thin film technology can be manufactured into large area and also on flexible substrate with low cost of production and can be used to exploit waste heat from equipments or hot surfaces in general. In the current implementation, the silicon structure has been designed and optimized with analytical models and FE simulations in order to exploit the different thermal conductivity of silicon and air gaps to produce the maximum temperature difference on a planar surface. The results showed that a temperature difference of 10K across the structure creates a temperature difference of 5.3K on the thermocouples, thus providing an efficiency of thermal distribution up to 55%, depending on the heat convection at the surface. Efficiency of module has been experimentally tested under different working condition, showing the dependence of module output on the external heat exchange (natural and forced convection). Maximum generated potential at 6m/s airflow is 5.7V/m(2) K and thermoelectric efficiency is 1.9 mu W Ka(-2)m(-2).