There are a large number of dangling bonds on Silicon wafer surface during processing, which tend to adsorb substance from surrounding environment to lower their energy. In order to prevent the deposition, adsorption state of pollutants must be controlled in physical adsorption. This paper analyzes the principle about pollutants' adsorption on the silicon wafer surface, and the mechanism of how surfactants to control the particles adsorption state and to prevent re-deposition of particles on the silicon wafer, in addition, gives advices about how to choose the surfactants. It also gets conclusions that composite polyether surfactants could lower the surface tension, enhance the wettability and dispersion of the liquid, effectively improve the space steric between particles and the silicon and prevent the secondary contamination.
