A better technique using multisegment modeling and analysis of high-density and high-speed connectors

被引:6
|
作者
Kao, CH [1 ]
Tseng, CC
Lee, FM
Lai, MF
机构
[1] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung 804, Taiwan
[2] Kun Shan Univ, Dept Elect Engn, Tainan 710, Taiwan
[3] Chinese Culture Univ, Sch Engn, Inst Mat Sci & Mfg, Taipei 11192, Taiwan
[4] Tung Nan Inst Technol, Dept Elect Engn, Taipei 222, Taiwan
来源
关键词
connectors; digital visual interface (DVI); modeling; multiply segmented and lumped coupled model; near-end cross-talk (NEXT); peripheral component interconnection (PCI); express; time-domain reflection (TDR);
D O I
10.1109/TADVP.2005.850509
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A useful and rather new simulation technique for connectors up to 6.25 GHz is presented and discussed in this paper. The proposed model extracts electrical parameters of a connector using time-domain reflectometry (TDR) measurements. A new technique was developed to obtain accurate impedance profiles using TDR and a multisegment approach that is effectively a distributed coupled model. The parameter extraction and characterization of connectors are discussed. The performance of the proposed segmented transmission line model is verified by simulation of the model in SPICE and by experimental measurement. The results show that the proposed model can simulate the electrical characteristics, including crosstalk and impedance, of high-density and high-speed connectors with satisfactory accuracy. Based on the proposed modeling and CAD simulators, the design and analysis of complicated high-density and high-speed connectors can be executed accurately and effectively. Compared with other previous models, the proposed model can significantly improve the accuracy of simulation.
引用
收藏
页码:140 / 148
页数:9
相关论文
共 50 条
  • [31] Optical disk drive for high-speed and high-density library system
    NTT Integrated Information &, Energy System Lab, Japan
    NTT R&D, 11 (1155-1160):
  • [32] A novel sensing scheme for high-speed & high-density ferroelectric RAM
    Choi, MK
    Jeon, BG
    Song, YJ
    Kim, K
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2002, 40 (04) : 697 - 700
  • [33] THERMAL DESIGN FOR HIGH-SPEED HIGH-DENSITY MULTICHIP-MODULE
    HANDA, T
    IIDA, S
    UTSUNOMIYA, J
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (04): : 384 - 387
  • [34] HIGH-SPEED, HIGH-DENSITY DEVICES TO DOMINATE ISSCC 83 SESSIONS
    TSANTES, J
    EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1983, 28 (04): : 51 - 54
  • [35] HIGH-DENSITY MULTIPIN CONNECTOR FOR HIGH-SPEED PULSE-PROPAGATION
    INAGAKI, S
    NAKANO, KI
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 496 - 501
  • [36] Advanced organic dye for high-speed, high-density optical media
    Kodaira, Takuo
    Matsuda, Isao
    Somei, Hidenori
    Tsuzuki, Takeo
    Yokoyama, Daizo
    Endo, Akihisa
    Takeguchi, Kazunobu
    Kojo, Shinichi
    Miyazawa, Fuyuki
    Otsu, Takeshi
    Murai, Wakaaki
    Hattori, Masashi
    Shimomai, Kenichi
    Oshita, Junji
    Asano, Sho
    Shimizu, Atsuo
    Fujii, Toru
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2015, 54 (09)
  • [37] Advanced packaging techniques for high-density, high-speed optoelectronics interconnects
    Liu, Fuhan
    Chang, Gee-Kung
    Wang, Fengtao
    Adibi, Ali
    Tummala, Rao
    ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, : 473 - 478
  • [38] OXIDE ISOLATION PROCESS FOR HIGH-DENSITY HIGH-SPEED BIPOLAR ICS
    KUMAR, R
    HOCHBERG, AK
    KRUEST, JR
    OH, KH
    RAU, J
    SHARMA, GC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (03) : C126 - C126
  • [39] HIGH-DENSITY MULTIPIN CONNECTOR FOR HIGH-SPEED PULSE PROPAGATION.
    Inagaki, Shuichiro
    Nakano, Ken-Ichi
    1600, (CHMT-10):
  • [40] AN INVESTIGATION OF SEPARATION LOSSES IN HIGH-SPEED HIGH-DENSITY RECORDING TAPES
    SPELIOTIS, DE
    BATE, G
    MORRISON, JR
    BRAUN, RE
    IEEE TRANSACTIONS ON MAGNETICS, 1965, MAG1 (02) : 101 - +