A better technique using multisegment modeling and analysis of high-density and high-speed connectors

被引:6
|
作者
Kao, CH [1 ]
Tseng, CC
Lee, FM
Lai, MF
机构
[1] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung 804, Taiwan
[2] Kun Shan Univ, Dept Elect Engn, Tainan 710, Taiwan
[3] Chinese Culture Univ, Sch Engn, Inst Mat Sci & Mfg, Taipei 11192, Taiwan
[4] Tung Nan Inst Technol, Dept Elect Engn, Taipei 222, Taiwan
来源
关键词
connectors; digital visual interface (DVI); modeling; multiply segmented and lumped coupled model; near-end cross-talk (NEXT); peripheral component interconnection (PCI); express; time-domain reflection (TDR);
D O I
10.1109/TADVP.2005.850509
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A useful and rather new simulation technique for connectors up to 6.25 GHz is presented and discussed in this paper. The proposed model extracts electrical parameters of a connector using time-domain reflectometry (TDR) measurements. A new technique was developed to obtain accurate impedance profiles using TDR and a multisegment approach that is effectively a distributed coupled model. The parameter extraction and characterization of connectors are discussed. The performance of the proposed segmented transmission line model is verified by simulation of the model in SPICE and by experimental measurement. The results show that the proposed model can simulate the electrical characteristics, including crosstalk and impedance, of high-density and high-speed connectors with satisfactory accuracy. Based on the proposed modeling and CAD simulators, the design and analysis of complicated high-density and high-speed connectors can be executed accurately and effectively. Compared with other previous models, the proposed model can significantly improve the accuracy of simulation.
引用
收藏
页码:140 / 148
页数:9
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