Microstructure and thermal conductivity of Cu/diamond composites with Ti-coated diamond particles produced by gas pressure infiltration

被引：107

作者：

Li, Jianwei ^{[1
]}

Zhang, Hailong ^{[1
]}

Zhang, Yang ^{[1
]}

Che, Zifan ^{[1
]}

Wang, Xitao ^{[1
]}

机构：

[1] Univ Sci & Technol Beijing, State Key Lab Adv Met & Mat, Beijing 100083, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2015年 / 647卷

基金：

中国国家自然科学基金;

关键词：

Metal matrix composites; Liquid-solid reactions; Heat conduction; Auger electron spectroscopy; CU-ZR/DIAMOND COMPOSITES; INTERMEDIATE LAYERS; COPPER; EXPANSION; PRETREATMENT; RESISTANCE; POWDER; MATRIX; SPS; CR;

D O I：

10.1016/j.jallcom.2015.06.062

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

As an attractive thermal management material, diamond particles reinforced Cu matrix (Cu/diamond) composites generally exhibit thermal conductivities lower than expected. To exploit the potential of heat conduction, a combination of Ti coating on diamond particles and gas pressure infiltration was used to prepare Cu/diamond(Ti) composites. A high thermal conductivity of 716 W/mK and a low coefficient of thermal expansion of 5.8 ppm/K at 323 K were obtained in the composites. Auger electron spectroscopy (AES) characterization shows that a TiC layer was formed between Cu matrix and diamond reinforcement, which is responsible for the enhancement of thermal conductivity. The results suggest that Ti coating can significantly promote interface bonding between Cu and diamond and gas pressure infiltration is an effective method to produce Cu/diamond composites. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：941 / 946

页数：6

共 33 条

[1] High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix [J].

Abyzov, Andrey M. ;

Kidalov, Sergey V. ;

Shakhov, Fedor M. .

JOURNAL OF MATERIALS SCIENCE, 2011, 46 (05) :1424-1438

[2] Chromium interlayers as a tool for enhancing diamond adhesion on copper [J].

Ali, N ;

Ahmed, W ;

Rego, CA ;

Fan, QH .

[3] Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites [J].

Bai, Hua ;

Ma, Nangang ;

Lang, Jing ;

Zhu, Congxu .

JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 580 :382-385

[4] Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder [J].

Bai, Hua ;

Ma, Nangang ;

Lang, Jing ;

Zhu, Congxu ;

Ma, Yi .

COMPOSITES PART B-ENGINEERING, 2013, 52 :182-186

[5] Interface formation in infiltrated Al(Si)/diamond composites [J].

Beffort, O. ;

Khalid, F. A. ;

Weber, L. ;

Ruch, P. ;

Klotz, U. E. ;

Meier, S. ;

Kleiner, S. .

[6]

Cengel YA., 1998, HEAT TRANSFER PRACTI

[7] The influence of minor titanium addition on thermal properties of diamond/copper composites via in situ reactive sintering [J].

Che, Q. L. ;

Chen, X. K. ;

Ji, Y. Q. ;

Li, Y. W. ;

Wang, L. X. ;

Cao, S. Z. ;

Jiang, Y. G. ;

Wang, Z. .

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2015, 30 :104-111

[8] Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique [J].

Chen, Hui ;

Jia, Cheng-chang ;

Li, Shang-jie ;

Jia, Xian ;

Yang, Xia .

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2012, 19 (04) :364-371

[9] On the thermal conductivity of Cu-Zr/diamond composites [J].

Chu, Ke ;

Jia, Chengchang ;

Guo, Hong ;

Li, Wensheng .

MATERIALS & DESIGN, 2013, 45 :36-42

[10] Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles [J].

Chu, Ke ;

Liu, Zhaofang ;

Jia, Chengchang ;

Chen, Hui ;

Liang, Xuebing ;

Gao, Wenjia ;

Tian, Wenhuai ;

Guo, Hong .

JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 490 (1-2) :453-458

← 1 2 3 4 →