Laser ablation of parallel optical interconnect waveguides

被引:39
作者
Van Steenberge, Geert [1 ]
Hendrickx, Nina
Bosman, Erwin
Van Erps, Jurgen
Thienpont, Hugo
Van Daele, Peter
机构
[1] Univ Ghent, IMEC, Dept Informat Technol, TFCG Microsyst, B-9052 Ghent, Belgium
[2] Vrije Univ Brussel, Dept Appl Phys & Photon, FirW, TONA, B-1050 Brussels, Belgium
关键词
laser ablation; optical interconnect; polymer; printed circuit board (PCB); waveguide;
D O I
10.1109/LPT.2006.873357
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Excimer laser ablation is presented as an alternative technology to photolithography for the fabrication of board-level parallel optical interconnect waveguides. Arrays of polymer multimode waveguides with a 50 x 50 mu m(2) cross section on a 125-mu m pitch are fully characterized. Root mean square sidewall roughness is 35 nm; no deposition of debris is observed on scanning electron microscope images. The first conclusion out of loss spectrum measurements is a "yellowing effect" of laser ablated waveguides' leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850, 980, and 1310 nm. This is verified at 850 nm by cutback measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm.
引用
收藏
页码:1106 / 1108
页数:3
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