Experimental work on micro laser-assisted diamond turning of silicon (111)

被引：91

作者：

Mohammadi, Hossein ^{[1
]}

Ravindra, Deepak ^{[2
]}

Kode, Sai K. ^{[2
]}

Patten, John A. ^{[1
]}

机构：

[1] Western Michigan Univ, Kalamazoo, MI 49008 USA

[2] MicroLAM Technol, Battle Creek, MI USA

来源：

JOURNAL OF MANUFACTURING PROCESSES | 2015年 / 19卷

基金：

美国国家科学基金会;

关键词：

mu-LAM; Silicon; SPOT; Laser; Surface finish; DUCTILE-REGIME; DAMAGE;

D O I：

10.1016/j.jmapro.2015.06.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (mu-LAM) technique to machine silicon (111). The mu-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. Cutting fluid, odorless mineral spirits (OMS), is used to decrease tool wear and improve the surface quality. An IR continuous wave (CW) fiber laser, wavelength of 1070 nm and max power of 100 W with a minimum beam diameter of 10 mu m, is used in this investigation. Various machining parameters such as laser power, cross feed rate and tool rake angle were experimented and the resultant surface finish was analyzed. Results show that an optical quality surface finish can be obtained using the mu-LAM technique. (C) 2015 The Society of Manufacturing Engineers. Published by Elsevier Ltd. All rights reserved.

引用

页码：125 / 128

页数：4

共 26 条

[1] Chip topography for ductile-regime machining of germanium [J].