A Wideband Bond-Wire Antenna for Millimeter Wave Intra-Communication Systems

被引：11
|
作者：
Ma, Yugang [1 ]
Kawasaki, Kenichi [2 ]
Masuda, Hisashi [1 ]
机构：
[1] Sony Elect, Singapore Res Lab, Singapore 117684, Singapore
[2] Sony Corp, Device Solut Business Unit, Kanagawa 2430021, Japan
来源：
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2013年 / 61卷 / 09期
关键词：
Bond-wire; bond-wire antenna (BWA); millimeter wave communications; monopole antenna; package antenna and wideband antenna; 60-GHZ RADIOS; TECHNOLOGY;
D O I：
10.1109/TAP.2013.2264478
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A compact and wideband millimeter wave bond-wire antenna (BWA) is proposed for consumer product intra-communications. The antenna consists of two 0.8 mm long wires in front of the ground plane. Its impedance bandwidth is 29 GHz (37 GHz to 66 GHz). It has 2 dBi average gain. After introducing the bandwidth widening solution to a wire antenna, the new BWA structure is presented. The antenna parameters including the impedance bandwidth, the radiation pattern and the gain versus frequency were simulated and compared with measured results. The proposed BWA was implemented in a CMOS integrated circuit (IC) millimeter communication system. 11 Gb/s wireless data transmission was achieved by using a part of the bandwidth of the proposed BWA.
引用
收藏
页码：4839 / 4843
页数：6
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