The role of shear stress in the formation of annealing twin boundaries in copper

被引:35
作者
Field, DP
Eames, RC
Lillo, TM
机构
[1] Washington State Univ, Sch Mech & Mat Engn, Pullman, WA 99164 USA
[2] Idaho Natl Engn Lab, Idaho Falls, ID 83415 USA
关键词
twin boundaries; copper; electron backscatter diffraction (EBSD); equal channel angular extrusion (ECAE) Thin films;
D O I
10.1016/j.scriptamat.2005.11.037
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Annealing twin boundaries are important in the evolution of grain boundary engineered materials. The development of annealing twins in face-centered cubic metals is a function of stacking fault energy and a number of other factors. It is observed that annealing heavily deformed copper under shear stress tends to promote the formation of twin boundaries. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:983 / 986
页数:4
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