Degradation of silicon bipolar junction transistors at high forward current densities

The physical degradation mechanisms of silicon bipolar junction transistors at high forward current densities were delineated quantitatively using three n/p/p and one p/n/p state-of-the-art submicron polysilicon-emitter transistor technologies. The increase of the operating current gain and decrease of emitter series resistance from million-ampere per square centimeter stress current are related to hydrogenation of the electronic traps at the metal-silicide/polycrystalline-Si and polycrystalline-Si/crystalline-Si emitter contact interfaces. A demonstration of the 10-year operation Time-to-Failure extrapolation methodology is also presented.