Study of MEMS and Silicon Pressure Sensor

被引：0

作者：

Fan, Yanli ^{[1
]}

Li, Qing'en ^{[1
]}

机构：

[1] Xinyang Power Supply Co, Dept Elect Transformat Overhaul, Xinyang 464000, Henan Province, Peoples R China

来源：

2012 2ND INTERNATIONAL CONFERENCE ON APPLIED ROBOTICS FOR THE POWER INDUSTRY (CARPI) | 2012年

关键词：

MEMS; Silicon; Pressure Sensor; Resonant; Analysis;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

MEMS technology opens up and develops a bran-new technology. MEMS technology is applied in many fields and is developing into kinds of huge industries. The silicon piezoresistive pressure sensor and resonance beam silicon pressure sensor are key branches of MEMS and are analyzed and discussed in detail in this paper. This paper provides relative references and basics for scientific research of silicon micro pressure sensor. The development tendency of resonance beam silicon pressure sensor is concluded and summarized. The development tendency can be concluded as miniaturization, integration, standardization, intelligentize and systematization. The advantages and disadvantages of the resonance beam silicon pressure sensor are summarized and its work basics is analyzed and discussed in this paper.

引用

页码：144 / 146

页数：3