A computerized model for thermal stresses in thin films

被引：5
作者：
Cherepanov, GP
Martinez, L
机构：
[1] Florida International University, College of Engineering and Design, Miami
来源：
COMPUTERS & STRUCTURES | 1997年 / 63卷 / 06期
关键词：
D O I：
10.1016/S0045-7949(96)00410-5
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
Thermal stresses are primarily responsible for morphological changes in thin films, including hillocks, whiskers and void or pit formations, which present serious problems of reliability in microelectronics. In the present paper, a computerized model for prediction of thermal stresses in thin films is suggested. The closed system of governing partial differential equations for thermal stresses in a thin film is utilized for any in-plane shape of the film. Some numerical experiments are conducted to verify the model. (C) 1997 Elsevier Science Ltd.
引用
收藏
页码：1095 / 1100
页数：6
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