Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic assisted transient liquid phase soldering process

被引：54

作者：

Zhao, H. Y. ^{[1
,2
]}

Liu, J. H. ^{[1
,2
]}

Li, Z. L. ^{[2
]}

Zhao, Y. X. ^{[1
,2
]}

Niu, H. W. ^{[2
]}

Song, X. G. ^{[1
,2
]}

Dong, H. J. ^{[2
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

[2] Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China

来源：

MATERIALS LETTERS | 2017年 / 186卷

关键词：

Intermetallic alloys and compounds; Interfaces; TLP soldering; Ultrasonic waves; Grain morphology; INTERMETALLIC COMPOUND JOINTS; CU-SN; MECHANISM;

D O I：

10.1016/j.matlet.2016.10.017

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The non-interfacial growth of Cu3Sn intermetallic compounds (IMCs) in a Cu/Sn/Cu interconnection structure during the ultrasonic-assisted transient liquid phase (TLP) soldering process was investigated. In the traditional TLP soldering process, the Cu3Sn phase always nucleated at Cu6Sn5/Cu interfaces and grew at the expense of the Cu6Sn5 phase and towards the joint centre, eventually forming a full intermetallic joint consisting of a single Cu3Sn phase with columnar grains. While in the ultrasonic-assisted TLP soldering process, the Cu3Sn phase nucleated and grew randomly within the whole joint, the resulting intermetallic joint consisted of a single Cu3Sn phase with equiaxed grains. This anomalous behaviour can be wholly ascribed to the effects ultrasonic on the nucleation and growth mechanisms of Cu3Sn.

引用

页码：283 / 288

页数：6

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