High-temperature tensile testing machine for investigation of brittle-ductile transition behavior of single crystal silicon microstructure

被引:12
|
作者
Uesugi, Akio [1 ]
Yasutomi, Takahiro [1 ]
Hirai, Yoshikazu [1 ]
Tsuchiya, Toshiyuki [1 ]
Tabata, Osamu [1 ]
机构
[1] Kyoto Univ, Dept Micro Engn, Kyoto 6158540, Japan
关键词
MECHANICAL-PROPERTIES; BENDING TEST; THIN-FILMS; LOW-CYCLE; FATIGUE; SPECIMENS; STRENGTH; MEMS; ENVIRONMENT; FABRICATION;
D O I
10.7567/JJAP.54.06FP04
中图分类号
O59 [应用物理学];
学科分类号
摘要
This paper reports development of a high-temperature tensile testing machine and testing of single crystal silicon (SCS) for investigation of the size effect on brittle-ductile transition temperature (BDTT). Two different-width (110) SCS specimens (120 mu m long, 5 mu m thick and 4 or 9 mu m wide) were tested in a vacuum at the temperature range from room temperature to 600 degrees C. The specimens tested at 500 degrees C and above exhibit slip, which indicated that the micrometer-sized silicon structures have lower BDTT compared to millimeter-sized ones. By investigating the temperature ranges of the slip occurrences among the differently-sized specimens including other researchers' reports, we found that the length along slip direction, i.e., thickness, might dominate the BDTT. (C) 2015 The Japan Society of Applied Physics
引用
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页数:5
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