Simulation of continuum heat conduction using DEM domains

被引:37
作者
Terreros, I. [1 ]
Iordanoff, I. [1 ,2 ]
Charles, J. L. [2 ]
机构
[1] Arts & Metiers ParisTech, MPI I2M, CNRS, UMR 5295, Paris, France
[2] Arts & Metiers ParisTech, DuMAS I2M, CNRS, UMR 5295, Paris, France
关键词
Discrete Element Method; Heat conduction; Thermal field; Transient temperature; Continuum materials; DISCRETE ELEMENT METHOD; PROOF-OF-CONCEPT;
D O I
10.1016/j.commatsci.2012.11.021
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Currently, almost all material manufacturing processes are simulated using methods based on continuum approaches such as the Finite Element Method (FEM). These methods, though widely studied, face difficulties with multibody, contact, high-strain and high-displacement problems, which are usually found in manufacturing processes. In some cases, the Discrete Element Method (DEM) is used to overcome these problems, but it is not yet able to simulate some of the physics of a continuum material, such as 3D heat transfer. To carry out a realistic simulation of a process, its thermal field must be properly predicted. This work describes a fast and efficient method to simulate heat conduction through a 3D continuum material using the Discrete Element Method. The material is modelled with spherical discrete elements of different sizes to obtain a compact and isotropic domain adequate for carrying out mechanical simulations to obtain straightforward thermal and mechanical coupling. Thermal simulations carried out with the proposed Discrete Element Method are compared to both the analytical and FEM results. This comparison shows excellent agreement and validates the proposed method. (C) 2012 Elsevier B. V. All rights reserved.
引用
收藏
页码:46 / 52
页数:7
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