Guaranteed passive coupled-microstrip interconnect modeling using finite element method

被引:0
|
作者
You, SH [1 ]
Kuester, EF [1 ]
机构
[1] Univ Colorado, Dept Elect & Comp Engn, Boulder, CO 80309 USA
关键词
coupled mode analysis; circuit synthesis; eddy currents; finite element methods; interconnect circuit; transient analysis; transmission lines;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As multichip modules (MCMs), monolithic microwave integrated circuits (MMICs) and printed circuit board (PCBs) can be found at various levels of the design hierarchy of high-speed electronics, it is essential to model them from the perspective of signal integrity. A new method has been developed to extract systematically a Foster equivalent lumped circuit for symmetrical coupled lossy lines from a two-dimensional FEM simulation. This method guarantees passivity of the resulting equivalent circuits for even and odd modes of the coupled lines. The results obtained from this method are verified by comparison with Ansoft's spicelink.
引用
收藏
页码:1431 / 1434
页数:4
相关论文
共 50 条
  • [1] Fast and direct coupled-microstrip-interconnect reduced-order modeling based on the finite-element method
    You, Se-Ho
    Kuester, Edward F.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2006, 54 (05) : 2232 - 2242
  • [2] Passive-guaranteed modeling and simulation of a finite element nonlinear string model
    Roze, David
    Raibaud, Mathis
    Geoffroy, Thibault
    IFAC PAPERSONLINE, 2024, 58 (06): : 226 - 231
  • [3] Design method of coupled-microstrip directional couplers based on equivalent admittance approach
    Fujii, T
    Kawai, T
    Ohta, I
    Kokubo, Y
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2005, 88 (07): : 11 - 18
  • [4] A compact approach to on-chip interconnect heat conduction modeling using the finite element method
    Gurrum, Siva P.
    Joshi, Yogendra K.
    King, William P.
    Ramakrishna, Koneru
    Gall, Martin
    JOURNAL OF ELECTRONIC PACKAGING, 2008, 130 (03) : 0310011 - 0310018
  • [5] Finite element modeling of misalignment in interconnect vias
    Holland, AS
    Reeves, GK
    Matthews, GK
    Leech, PW
    COMMAD 04: 2004 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS AND DEVICES, PROCEEDINGS, 2005, : 307 - 310
  • [6] Finite element modeling for interconnect materials and structures
    Bassman, L
    Pinsky, P
    Deal, M
    ADVANCED INTERCONNECTS AND CONTACT MATERIALS AND PROCESSES FOR FUTURE INTEGRATED CIRCUITS, 1998, 514 : 299 - 299
  • [7] Finite Element Method for Calculating Capacitance and Inductance of Symmetrical Coupled Microstrip lines
    Musa, S. M.
    Sadiku, M. N. O.
    Momoh, O. D.
    2012 PROCEEDINGS OF IEEE SOUTHEASTCON, 2012,
  • [8] Analysis of deformed microstrip resonator using the finite element method
    Chaudhari, AS
    Patil, PB
    SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES, 1997, 22 (5): : 649 - 657
  • [9] Analysis of deformed microstrip resonator using the finite element method
    A S Chaudhari
    P B Patil
    Sadhana, 1997, 22 : 649 - 657
  • [10] Analysis of planar microstrip antennas using the finite element method
    Hestand, R
    Christodoulou, C
    PROCEEDINGS OF THE IEEE SOUTHEASTCON '96: BRINGING TOGETHER EDUCATION, SCIENCE AND TECHNOLOGY, 1996, : 136 - 139