A manufacturable poly-emitter graded-SiGe HBT technology for wireless and mixed-signal applications

被引:3
|
作者
NguyenNgoc, D [1 ]
Sunderland, DA [1 ]
Ahlgren, DC [1 ]
Jeng, SJ [1 ]
Gilbert, MM [1 ]
Malinowski, JC [1 ]
Schonenberg, KT [1 ]
Stein, KS [1 ]
Meyerson, BS [1 ]
Harame, DL [1 ]
机构
[1] IBM CORP,DIV RES,YORKTOWN HTS,NY 10598
关键词
D O I
10.1016/0169-4332(96)00048-7
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Graded SiGe-base heterojunction transistors (HBTs) offer the advantages of bandgap engineering while maintaining the cost and manufacturing benefits of the silicon industry. For a technology to be widely used in the mixed signal applications arena it must offer more than just the HBT: it must have a complete set of passive elements and interconnects suitable for the rf design environment. This paper describes the development and current status of IBM's advanced SiGe HBT technology installed on a 200 mm CMOS/DRAM line. It reviews basic principles of HBT operation. discusses the aspects of the ultra high vacuum chemical vapor deposition (UKV/CVD) growth technique, describes the overall SiGe HBT process, the performance of the HBTs and support devices, and the circuit results achieved to date.
引用
收藏
页码:194 / 201
页数:8
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