Design and CAD for 3D integrated circuits

被引：0

作者：

Franzon, Paul D. ^{[1
]}

Davis, W. Rhett ^{[1
]}

Steer, Michael B. ^{[1
]}

Lipa, Steve ^{[1
]}

Oh, Eun Chu ^{[1
]}

Thorolfsson, Thor ^{[1
]}

Melamed, Samson ^{[1
]}

Luniya, Sonali ^{[1
]}

Doxsee, Tad ^{[2
]}

Berkeley, Stephen ^{[2
]}

Shani, Ben ^{[2
]}

Obermiller, Kurt ^{[2
]}

机构：

[1] N Carolina State Univ, ECE, Box 7911, Raleigh, NC 27695 USA

[2] PTC Inc, Needham, MA USA

来源：

2008 45TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2 | 2008年

关键词：

3DIC; Through Silicon Via; TSV; thermal modeling;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

High density Through Silicon Vias (TSV) can be used to build 3DICs that enable unique applications in computing, signal processing and memory intensive systems. This paper presents several case studies that are uniquely enhanced through 3D implementation, including a 3D CAM, an FFT processor, and a SAR processor. The CAD flow used to implement for these designs is described 3DIC requires higher fidelity thermal modeling than 2DIC design. The rationale for this requirement is established and a possible solution is presented.

引用

页码：668 / +

页数：2

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