Versatile stream buffer architecture to exploit the high memory bandwidth of 3-D IC technology

被引:0
|
作者
Lim, Hong-Yeol [1 ]
Park, Gi-Ho [1 ]
机构
[1] Sejong Univ, Dept Comp Engn, Seoul 143747, South Korea
来源
IEICE ELECTRONICS EXPRESS | 2013年 / 10卷 / 04期
基金
新加坡国家研究基金会;
关键词
3-D integration technology; stream buffer; victim cache;
D O I
10.1587/elex.10.20120971
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Three-dimensional (3-D) integration technology provides various architectural opportunities including huge memory bandwidth. This paper proposes versatile stream buffer architecture to work as a secondary victim cache as well as the conventional stream buffer. The versatile stream buffer utilizes empty spaces to exploit massive memory bandwidth provided by 3-D integration technology and to reduce memory access frequency. Performance evaluation results show that the proposed mechanism with a 16KB stream buffer and a 4KB victim cache can achieve better performance than the conventional L2 cache with the capacity of 256KB and 2MB by 10% and 3%, respectively. The proposed mechanism reduces the miss rate by about 12% more than the conventional L2 cache with the capacity of 256 KB.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] An adaptive L2 cache prefetching mechanism for effective exploitation of abundant memory bandwidth of 3-D IC technology
    Lim, Hong-Yeol
    Park, Gi-Ho
    IEICE ELECTRONICS EXPRESS, 2013, 10 (16):
  • [2] HBM (High Bandwidth Memory) DRAM Technology and Architecture
    Jun, Hongshin
    Cho, Jinhee
    Lee, Kangseol
    Son, Ho-Young
    Kim, Kwiwook
    Jin, Hanho
    Kim, Keith
    2017 IEEE 9TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2017, : 99 - 102
  • [3] A memory efficient 3-d DWT architecture
    Das, B
    Banerjee, S
    16TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS, 2003, : 208 - 213
  • [4] TSV Redundancy: Architecture and Design Issues in 3-D IC
    Hsieh, Ang-Chih
    Hwang, TingTing
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2012, 20 (04) : 711 - 722
  • [5] Architecture of 3D Memory Cell Array on 3D IC
    Lee, Sang-Yun
    Park, Junil
    2012 4TH IEEE INTERNATIONAL MEMORY WORKSHOP (IMW), 2012,
  • [6] 3D technology with application to high bandwidth and processor-memory modules
    1600, IMAPS-International Microelectronics and Packaging Society (40):
  • [8] Optically augmented 3-D computer: System technology and architecture
    Marchand, PJ
    Krishnamoorthy, AV
    Yayla, GI
    Esener, SC
    Efron, U
    JOURNAL OF PARALLEL AND DISTRIBUTED COMPUTING, 1997, 41 (01) : 20 - 35
  • [9] IC Thermal Analyzer for Versatile 3-D Structures Using Multigrid Preconditioned Krylov Methods
    Ladenheim, Scott
    Chen, Yi-Chung
    Mihajlovic, Milan
    Pavlidis, Vasilis
    2016 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2016,
  • [10] Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs
    Byun, Hyung Joon
    Gupta, Udit
    Seo, Jae-Sun
    IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 2024, 10 : 98 - 106