In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing

被引：2

作者：

Davis, Cleon E. ^{[1
]}

Dickherber, Anthony J. ^{[2
]}

Hunt, William D. ^{[2
]}

May, Gary S. ^{[2
]}

机构：

[1] Johns Hopkins Univ, Appl Phys Lab, Laurel, MD 20723 USA

[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2008年 / 31卷 / 04期

基金：

美国国家科学基金会;

关键词：

Acoustic temperature sensing; polymer curing; rapid curing; variable frequency microwave curing; zinc oxide deposition;

D O I：

10.1109/TEPM.2008.2004570

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20 degrees C to 300 degrees C with an attainable accuracy of 2 degrees.

引用

页码：273 / 284

页数：12

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