Cooling rate and microstructure of rapidly solidified Al-20 wt.% Si alloy

被引：99

作者：

Xu, CL ^{[1
]}

Wang, HY ^{[1
]}

Qiu, F ^{[1
]}

Yang, YF ^{[1
]}

Jiang, QC ^{[1
]}

机构：

[1] Jilin Univ, Dept Mat Sci & Engn, Minist Educ, Key Lab Automobile Mat, Changchun 130025, Peoples R China

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 417卷 / 1-2期

基金：

中国国家自然科学基金;

关键词：

melt-spun ribbon; temperature distribution; cooling rate; Al-Si alloys;

D O I：

10.1016/j.msea.2005.10.040

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A 40 mu m thick melt-spun ribbon was manufactured by using a single roller melt-spinning technique, and the temperature distribution of the melt-spun ribbon was obtained. The solidification time and the cooling rate of the melt-spun ribbon were estimated to be 6.59 x 10(-5) s and 1.11 X 10(6) degrees C/s, respectively. The morphologies of primary silicon in the melt-spun ribbon were drastically changed to fine block-shape (maximum size of primary silicon is 5 mu m, minimum size of primary silicon is 0.5 mu m and average size of primary silicon is 2 mu m), and the smaller eutectic silicon can be obtained due to the rapid solidification. (c) 2005 Elsevier B.V. All rights reserved.

引用

页码：275 / 280

页数：6

共 13 条

[1]

AN GY, 1990, PRINCIPLE CASTINGS F, P46

[2]

CARSLAW HS, 1986, CONDUCTION HEAT SOLI, P485

[3] ELECTRONIC-PROPERTIES AND SUPERCONDUCTIVITY OF RAPIDLY QUENCHED AL-SI ALLOYS [J].