Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter

被引:20
作者
Ning, Puqi [1 ]
Wang, Fei [2 ]
Ngo, Khai D. T. [3 ]
机构
[1] Chinese Acad Sci, Beijing Engn Lab Elect Dr Syst & Power Elect Devi, Key Lab Power Elect & Elect Dr, Inst Elect Engn, Beijing 100190, Peoples R China
[2] Univ Tennessee, Dept Elect Engn & Comp Sci, Knoxville, TN 37996 USA
[3] Virginia Polytech Inst & State Univ, Dept Elect & Comp Engn, Blacksburg, VA 24061 USA
关键词
Numerical methods - Cooling systems - Design - Thermoelectric equipment;
D O I
10.1109/TPEL.2013.2271259
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An analytical model has been developed for predicting the forced-air cooling system performance, including a detailed optimization process to minimize the total weight. With a design example in a high-density high-temperature SiC converter, the presented design method was verified through numerical simulations and experiments.
引用
收藏
页码:1998 / 2007
页数:10
相关论文
共 13 条
[1]   THERMALLY OPTIMUM SPACING OF VERTICAL, NATURAL-CONVECTION COOLED, PARALLEL PLATES [J].
BARCOHEN, A ;
ROHSENOW, WM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1984, 106 (01) :116-123
[2]   A novel high density 100kW three-phase silicon carbide (SIC) multichip power module (MCPM) inverter [J].
Cilio, Edgar ;
Hornberger, Jared ;
McPherson, Brice ;
Schupbach, Roberto ;
Lostetter, Alexander ;
Garrett, John .
APEC 2007: TWENTY-SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2, 2007, :666-+
[3]   Optimization of plate fin heat sinks using entropy generation minimization [J].
Culham, JR ;
Muzychka, YS .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (02) :159-165
[4]  
Drofenik U., 2008, P 4 INT C INT POW SY, P323
[5]  
Drofenik U., 2005, PROC PCIM 05, P608
[6]   Sub-optimum design of a forced air cooled heat sink for simple manufacturing [J].
Drofenik, Uwe ;
Kolar, Johann W. .
2007 POWER CONVERSION CONFERENCE - NAGOYA, VOLS 1-3, 2007, :1156-+
[7]   Influence of bypass on flow through plate fin heat sinks [J].
Hossain, Rakib ;
Culham, J. Richard ;
Yovanovich, M. Michael .
TWENTY-THIRD ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2007, 2007, :220-+
[8]  
Lee S., 1995, P 11 IEEE SEM S
[9]  
LEONHARD W, 2002, P POW GEN REN EN SOU, P1
[10]   Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy [J].
Shih, CJ ;
Liu, GC .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (03) :551-559