Thermal and electrical conduction in 6.4 nm thin gold films

被引:34
作者
Lin, Huan [1 ,2 ]
Xu, Shen [1 ]
Li, Chong [1 ]
Dong, Hua [3 ]
Wang, Xinwei [1 ,3 ]
机构
[1] Iowa State Univ, Dept Mech Engn, Ames, IA 50011 USA
[2] Ocean Univ China, Coll Engn, Qingdao 266100, Shandong, Peoples R China
[3] Qingdao Technol Univ, Sch Environm & Municipal Engn, Qingdao 266033, Shandong, Peoples R China
基金
美国国家科学基金会;
关键词
METAL-FILMS; POLYCRYSTALLINE FILMS; EXTERNAL SURFACES; RESISTIVITY MODEL; REFLECTION; TRANSPORT;
D O I
10.1039/c3nr00729d
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
For sub-10 nmthinmetallic films, very little knowledge is available so far on how electron scattering at surface and grain boundaries reduces the thermal transport. This work reports on the first time characterization of the thermal and electrical conductivities of gold films of 6.4 nm average thickness. The electrical (sigma) and thermal (k) conductivities of the Au film are found to be reduced dramatically from their bulk counterparts by 93.7% (sigma) and 80.5% (k). Its Lorenz number is measured as 7.44 x 10(-8) W Omega K-2, almost a twofold increase from the bulk value. The Mayadas-Shatzkes model is used to interpret the experimental results and reveals very strong electron reflection (77%) at grain boundaries.
引用
收藏
页码:4652 / 4656
页数:5
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