Effect of Thermal Process on the Microstructure and Property of Si/Al Composite with High Si Content

50vol. %Si/Al composite was prepared by the separation of liquid and solid in semi-solid. The microstructures of composite were obtained using OM, SEM and EMPA. The primary Si particles distribute uniformly on the Al matrix which surrounds the Si particles and makes-up a continuous network. The thermal expansion coefficient and thermal conductivity of composites experienced different thermal process were examined. It shows that the thermal process history has a significant effect on the microstructure and properties. The residual stress and size of Si particles varied during thermal processing which were responsible for the thermal expansion coefficient alternation. The thermal process of high temperature insostatic pressing reduces the porosity in composite and improves thermal conductivity obviously.