Two-step heating transient liquid phase bonding of Inconel 738LC

被引：14

作者：

Amirkhani, A. ^{[1
]}

Beidokhti, B. ^{[2
]}

Shirvani, K. ^{[3
]}

Rahimipour, M. R. ^{[1
]}

机构：

[1] Mat & Energy Res Ctr, Dept Ceram, Karaj 31787316, Iran

[2] Ferdowsi Univ Mashhad, Fac Engn, Mat & Met Engn Dept, Mashhad, Iran

[3] Iranian Res Org Sci & Technol, Dept Adv Mat & New Energies, Tehran 158153538, Iran

来源：

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2019年 / 266卷

关键词：

Two-step heating TLP; Bonding; Superalloy; Microstructure; INTERLAYER THICKNESS; MICROSTRUCTURE; SOLIDIFICATION; EVOLUTION; TEMPERATURE; PARAMETERS; JOINTS;

D O I：

10.1016/j.jmatprotec.2018.10.008

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The high-temperature short-time heating step was followed by the low-temperature isothermal solidification step to join IN-738LC superalloy. The shorter bonding time can be applied in comparison to the conventional transient liquid phase process. A dendritic-cell like initial interface was observed which is different from a planar interface of conventional TLP bonds. This led to non-uniform distribution of voids along the joint. By completion of the isothermal solidification, quantity and size of the voids were decreased. A homogenization heat treatment produced the microstructure similar to that of the base metal.

引用

页码：1 / 9

页数：9

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