Effect of Cooling Rate and Silicon Refiner/Modifier on Solidification Pathways of Al-11.3Si-2Cu-0.4Fe Alloy

被引：19

作者：

Farahany, Saeed ^{[1
]}

Ourdjini, Ali ^{[1
]}

机构：

[1] UTM, Fac Mech Engn, Dept Mat Engn, Johor Baharu 81310, Malaysia

来源：

MATERIALS AND MANUFACTURING PROCESSES | 2013年 / 28卷 / 06期

关键词：

Aluminium; Bismuth; Intermetallic; Solidification; Thermal analysis; EUTECTIC MODIFICATION LEVEL; THERMAL-ANALYSIS; MICROSTRUCTURE; ALUMINUM;

D O I：

10.1080/10426914.2013.763972

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The solidification behavior of a complex Al-11.3Si-2Cu-0.4Fe alloy with separate additions of 0.85% bismuth (Bi), 0.42% antimony (Sb), and 0.04% strontium (Sr) and cooled at rates between 0.5 and 2 degrees C/s was examined by using a combination of computer-aided cooling curve thermal analysis (CA-CCTA) and interrupted quenching tests. Results show that the sequence of phase formations is in the following order: dendritic Al, pre-eutectic Al-15(Fe,Mn)(3)(Si,Cu)(2) and -Al5FeSi intermetallics, eutectic Al-Si, and post-eutectic Al2Cu. Bi, Sb, and Sr additions had a significant effect on the onset of Al-Si and Al2Cu phases, with Sr having the strongest effect by decreasing the nucleation temperature of Al-Si. On the other hand, Bi addition increased the solidification range. Nucleation temperature of primary Al and Al2Cu phase increased as cooling rate increased. The coherency temperature decreased, and the fraction solid at the coherency point increased with increasing cooling rate. A relationship between solidification temperature range and fraction solid for each phase evolutions was observed.

引用

页码：657 / 663

页数：7

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