Interplay of voltage and temperature acceleration of oxide breakdown for ultra-thin oxides

被引:9
|
作者
Wu, E
Suñé, J
Lai, W
Nowak, E
McKenna, J
Vayshenker, A
Harmon, D
机构
[1] IBM Corp, Microelect Div, Essex Jct, VT 05452 USA
[2] Univ Autonoma Barcelona, Dept Enginyeria Elect, Bellaterra 08193, Spain
[3] IBM Corp, Microelect Div, Hopewell Jct, NY USA
关键词
ultra-thin oxide reliability; oxide breakdown; gate dielectric; TDDB;
D O I
10.1016/S0167-9317(01)00629-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, we unequivocally demonstrate that strong temperature dependence of time(charge)-to-breakdown T-BD/Q(BD) observed on ultra-thin oxides is not a thickness effect but rather a consequence of two experimental facts: (1) voltage-dependent voltage acceleration and (2) temperature-independent voltage acceleration within a fixed T-BD window. By extending down to -30 degreesC, we found non-Arrhenius temperature dependence is a totally independent effect. Based on our statistically accurate experimental database, we found that defect-generation rate and critical defect density as commonly measured using stress-induced leak-age current (SILC) only show a change of two orders of magnitude and no change, respectively. Weibull slopes are also found to be temperature-independent. We propose an alternative model of two-step hydrogen degradation to explain these experimental results. (C) 2001 Published by Elsevier Science B.V.
引用
收藏
页码:25 / 31
页数:7
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