Characteristics of a field plate connected to T-shaped gate in AlGaN/GaN HEMTs

被引:3
作者
Cho, Kyu Jun [1 ]
Ahn, Ho Kyun [1 ]
Kim, Sung Il [1 ]
Kang, Dong Min [1 ]
Lee, Jong Min [1 ]
Min, Byoung Gue [1 ]
Lee, Sang Heung [1 ]
Kim, Dong Yung [1 ]
Yoon, Hyung Sup [1 ]
Kim, Hae Cheon [1 ]
Lee, Kyung Ho [1 ]
Ju, Chul Won [1 ]
Lim, Jong Won [1 ]
Kwon, Yong Hwan [1 ]
Nam, Eun Soo [1 ]
机构
[1] Elect & Telecommun Res Inst, Components & Mat Res Lab, Taejon 305700, South Korea
关键词
GaN; HEMT; Field plate; T-shaped gate; Breakdown voltage; BREAKDOWN VOLTAGE; SURFACE PASSIVATION; ENHANCEMENT;
D O I
10.3938/jkps.67.682
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
An AlGaN/GaN high electron mobility transistor (HEMT) with a T-shaped gate employing a gate-foot-connected field plate is presented. Similar to other devices with gate connected field plates the device described in this paper is a variation of the I"-shaped gate with the "head" of the Tshaped gate attached at the top. The proposed device has a higher breakdown voltage and a lower leakage current due to the attached field plate while maintaining the advantages of the T-shaped gate structure, which are a low gate resistance and a low noise level. In addition, the field plate deposition step during the fabrication process involves a partial covering of the "foot" of the gate which showed a possibility for a gate length reduction.
引用
收藏
页码:682 / 686
页数:5
相关论文
共 11 条
[1]   Effect of surface passivation on performance of AlGaN/GaN/Si HEMTs [J].
Bernát, J ;
Javorka, P ;
Fox, A ;
Marso, M ;
Lüth, H ;
Kordos, P .
SOLID-STATE ELECTRONICS, 2003, 47 (11) :2097-2103
[2]   Impact of field-plate geometry on the reliability of GaN-on-SiC HEMTs [J].
Chini, A. ;
Soci, F. ;
Fantini, F. ;
Nanni, A. ;
Pantellini, A. ;
Lanzieri, C. ;
Meneghesso, G. ;
Zanoni, E. .
MICROELECTRONICS RELIABILITY, 2013, 53 (9-11) :1461-1465
[3]   Design of AlGaN/GaN HEMTs employing mesa field plate for breakdown voltage enhancement [J].
Cho, Kyu-Heon ;
Kim, Young-Shil ;
Lim, Jiyong ;
Choi, Young-Hwan ;
Han, Min-Koo .
SOLID-STATE ELECTRONICS, 2010, 54 (04) :405-409
[4]  
Huang H., 2014, POWER ELECT IEEE T, V29, P2173
[5]   Enhancement of breakdown voltage in AlGaN/GaN high electron mobility transistors using a field plate [J].
Karmalkar, S ;
Mishra, UK .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (08) :1515-1521
[6]   High breakdown voltage GaNHFET with field plate [J].
Li, J ;
Cai, SJ ;
Pan, GZ ;
Chen, YL ;
Wen, CP ;
Wang, KL .
ELECTRONICS LETTERS, 2001, 37 (03) :196-197
[7]   A comparative study of surface passivation on AlGaN/GaN HEMTs [J].
Lu, W ;
Kumar, V ;
Schwindt, R ;
Piner, E ;
Adesida, I .
SOLID-STATE ELECTRONICS, 2002, 46 (09) :1441-1444
[8]   AlGaN/GaN HEMTs - An overview of device operation and applications [J].
Mishra, UK ;
Parikh, P ;
Wu, YF .
PROCEEDINGS OF THE IEEE, 2002, 90 (06) :1022-1031
[9]   Influence of field plates and surface traps on microwave silicon carbide MESFETs [J].
Nilsson, Per-Ake ;
Allerstam, Fredrik ;
Sudow, Mattias ;
Andersson, Kristoffer ;
Hjelmgren, Hans ;
Sveinbjornsson, Einar O. ;
Rorsman, Niklas .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (08) :1875-1879
[10]   Field-Plate Structure Dependence of Current Collapse Phenomena in High-Voltage GaN-HEMTs [J].
Saito, Wataru ;
Kakiuchi, Yorito ;
Nitta, Tomohiro ;
Saito, Yasunobu ;
Noda, Takao ;
Fujimoto, Hidetoshi ;
Yoshioka, Akira ;
Ohno, Tetsuya ;
Yamaguchi, Masakazu .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (07) :659-661