Electric Current-Induced Mass Flow in Very Thin Infinite Metallic Films

被引:24
作者
Talukder, Santanu [1 ]
Kumar, Praveen [2 ]
Pratap, Rudra [1 ,3 ]
机构
[1] Indian Inst Sci, Ctr Nano Sci & Engn, Bangalore 560012, Karnataka, India
[2] Indian Inst Sci, Dept Mat Engn, Bangalore 560012, Karnataka, India
[3] Indian Inst Sci, Dept Mech Engn, Bangalore 560012, Karnataka, India
关键词
Electromigration; liquid electromigration; reliability; very thin films; ELECTROMIGRATION FAILURE; ALUMINUM FILMS; THERMOMIGRATION; INTERCONNECTS;
D O I
10.1109/TED.2013.2273949
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on the mass transport behavior of infinitely extended, continuous, and very thin metallic films under the influence of electric current. Application of direct current of high densities (> 10(8) A/m(2)) results in visible melting of thin film at only one of the electrodes, and the melt then flows towards the other electrode in a circularly symmetric fashion forming a microscale ring pattern. For the two tested thin film systems, namely Cr and Al, of thicknesses ranging from 4 to 20 nm, the above directional flow consistently occurred from cathode to anode and anode to cathode, respectively. Furthermore, application of alternating electric current results in flow of the liquid material from both the electrodes. The dependence of critical flow behavior parameters, such as flow direction, flow velocity, and evolution of the ring diameter, are experimentally determined. Analytical models based on the principles of electromigration in liquid-phase materials are developed to explain the experimental observations.
引用
收藏
页码:2877 / 2883
页数:7
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