Research on Thermal Conduction and Mechanical Properties for Carbon Foam

被引：3

作者：

Tian Zhuo ^{[1
]}

Li Ke-Zhi ^{[1
]}

Li He-Jun ^{[1
]}

Shi Zhen-Hai ^{[1
]}

机构：

[1] Northwestern Polytech Univ, C C Composites Technol Res Ctr, Xian 710072, Peoples R China

来源：

JOURNAL OF INORGANIC MATERIALS | 2008年 / 23卷 / 06期

基金：

欧盟地平线“2020”;

关键词：

thermal conduction; mechanical properties; carbon foam;

D O I：

10.3724/SP.J.1077.2008.01171

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The phenolic resin foam was prepared by using hollow phenolic resin microspher which was made by microcapsule. And under the protection of Ar, the microcapsules were carbonized at 1000 degrees C and graphited at 2000 degrees C, then the foam was got. Herein the porosity and the effect of heat treatment temperature on carbon foam were investigated. And the results show that the porosity increasement can reduce the thermal conduction of material, and the low thermal conduction foam is obtained by using this method. However, for the materials with approximative porosity, the thermal conduction is decreased by reducing aperture of material. Finally, the foam material is obtained with density of 0.50g/cm(3), thermal conduction of 1.007W/m.K and compressive strength of 8.82MPa.

引用

页码：1171 / 1174

页数：4

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