Effect of cooling rate on solidification of electron beam melted silicon ingots

被引:12
作者
Tan, Yi [1 ,2 ]
Shi, Shuang [1 ,2 ]
Guo, Xiaoliang [1 ,2 ]
Jiang, Dachuan [1 ,2 ]
Dong, Wei [1 ,2 ]
Ren, Shiqiang [1 ,2 ]
机构
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Peoples R China
[2] Key Lab Solar Energy Photovolta Syst Liaoning Pro, Dalian 116023, Peoples R China
基金
中国国家自然科学基金;
关键词
Electron beam melting; Silicon; Cooling rate; Solidification; METALLURGICAL-GRADE SILICON; MULTICRYSTALLINE SILICON; MOLTEN SILICON; METAL IMPURITIES; REMOVAL; PURIFICATION; EVAPORATION; ALUMINUM;
D O I
10.1016/j.vacuum.2012.08.013
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Solidification rate has a significant influence on purification of silicon due to segregation of impurities at a liquid solid interface of a solidifying silicon ingot. A mathematical model is developed to evaluate time-dependent position of the liquid solid interface and solidification rate of electron beam melted ingots. A series of solidification experiments with different cooling rates are conducted to measure position of a line which separates directionally grown columnar crystals visible in cross-sections of the solidified ingots. Results show that not the whole ingot solidifies directionally when the reduction rate of the beam current is larger than 1.67 mA/s. The position of the dividing line depends on cooling rate and the experimental trend is consistent with that resulted from theoretical simulations. Modeling shows that the solidification rate changes fast when the beam current reduces linearly that is detrimental for segregation of impurities. It also predicts that an exponential reduction of the beam current leads to a uniform solidification rate which is beneficial to segregation of impurities, though not all exponential current reductions lead to this kind of solidification behavior. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:12 / 16
页数:5
相关论文
共 50 条
  • [21] Effect of cooling rate on solidification characteristics of aluminium alloy AA 5182
    Thompson, S
    Cockcroft, SL
    Wells, MA
    MATERIALS SCIENCE AND TECHNOLOGY, 2004, 20 (04) : 497 - 504
  • [22] Effect of Superheated Temperature and Cooling Rate on the Solidification of Undercooled Ti Melt
    Fan Dandan
    Xu Junfeng
    Zhong Yanan
    Jian Zengyun
    ACTA METALLURGICA SINICA, 2018, 54 (06) : 844 - 850
  • [23] Solidification temperature of silicon surface layer melted by pulsed laser irradiation
    Ivlev, GD
    Gatskevich, EI
    APPLIED SURFACE SCIENCE, 1999, 143 (1-4) : 265 - 271
  • [24] Kinetics of volatile impurity removal from silicon by electron beam melting for photovoltaic applications
    Shi, Shuang
    Li, Pengting
    Meng, Jianxiong
    Jiang, Dachuan
    Tan, Yi
    Asghar, H. M. Noor ul Huda Khan
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2017, 19 (41) : 28424 - 28433
  • [25] Effect of electron beam injection on boron redistribution in silicon and oxide layer
    Qin, Shiqiang
    Tan, Yi
    Li, Jiayan
    Jiang, Dachuan
    Wen, Shutao
    Shi, Shuang
    MATERIALS SCIENCE-POLAND, 2017, 35 (01): : 14 - 17
  • [26] Influence of pulling rate on multicrystalline silicon ingots' properties
    Autruffe, Antoine
    Sondena, Rune
    Vines, Lasse
    Arnberg, Lars
    Di Sabatino, Marisa
    JOURNAL OF CRYSTAL GROWTH, 2014, 386 : 199 - 203
  • [27] Impurities evaporation from metallurgical-grade silicon in electron beam melting process
    Wang Qiang
    Dong Wei
    Tan Yi
    Jiang Dachuan
    Zhang Cong
    Peng Xu
    RARE METALS, 2011, 30 (03) : 274 - 277
  • [28] Progress in Research and Development of Solar-grade Silicon Preparation by Electron Beam Melting
    Tan Yi
    Shi Shuang
    Jiang Da-Chuan
    JOURNAL OF INORGANIC MATERIALS, 2015, 30 (08) : 785 - 792
  • [29] Effect of cooling rate on the microporosity in the fusion zone of electron beam welded IN738LC joint
    Han, Ke
    Wang, Houqin
    Peng, Fei
    Zhang, Binggang
    MATERIALS LETTERS, 2020, 258
  • [30] Effect of Pulling Rate on Multicrystalline Silicon Ingot during Directional Solidification
    Sun, Shihai
    Tan, Yi
    Zhang, Huixing
    Dong, Wei
    Zhang, Junshan
    Hu, Genxiong
    ADVANCED MATERIAL SCIENCE AND TECHNOLOGY, PTS 1 AND 2, 2011, 675-677 : 53 - 56