Advanced Thermal Modeling of IC - Package Interaction

被引：0

作者：

Cao, Zhibo ^{[1
]}

Stocchi, Matteo ^{[1
]}

Wietstruck, Matthias ^{[1
]}

Garbuglia, Federico ^{[1
]}

Pincini, Diego ^{[1
]}

Kaynak, Mehmet ^{[1
,2
]}

机构：

[1] IHP Leibniz Inst Innovat Mikroelekt, D-15236 Frankfurt, Oder, Germany

[2] Sabanci Univ, TR-34956 Istanbul, Tuzla, Turkey

来源：

2020 IEEE RADIO AND WIRELESS SYMPOSIUM (RWS 2020) | 2020年

关键词：

ANSYS; COMSOL; finite element method; thermal; convection;

D O I：

暂无

中图分类号：

TN [电子技术、通信技术];

学科分类号：

0809 ;

摘要：

A layout based finite element thermal convection model including detailed board tracing and packaging information is developed. A state-of-art 0.13-mu m SiGe BiCMOS chip with embedded poly-resistors and thermal diodes are used as experimental validations of thermal modelling results. The designated thermal model demonstrates a high accuracy of less than 1.5 Celsius deviation from experimental results. And the layout based automatic generation of model geometry drastically reduces time consumption during model development and, moreover, paves the way for modelling of packages which possess even higher complexities.

引用

页码：326 / 329

页数：4

共 50 条

[1] Thermal modeling of enhancement LED package
Weng, Chun-Jen
EDSSC: 2008 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2008, : 13 - 16
[2] Thermal characterization of tape BGA package by modeling
Han, JB
MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING, 2000, 4229 : 202 - 208
[3] Challenges in IC-Package-PCB Co-design of an Advanced Flip-Chip PoP Package for a Mobile Application
Lecoq, Xavier
Cosmo, Stephane
Bacle, Prem
Devey, Corinne
Bayet, Olivier
Schwarz, Laurent
2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
[4] Device and package level thermal modeling of GaAs power amplifiers
Vijayakumar, B
Burton, R
Guo, Y
ITHERM 2004, VOL 1, 2004, : 291 - 296
[5] A simplified modeling technique for finite element thermal analysis of a plastic SOIC package
Mak, TWC
Feinstein, LG
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (01): : 6 - 10
[6] Thermal Modelling of IC Packages
Fodor, Alexandra
Jano, Rajmond
2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2013, : 149 - 152
[7] Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
You, Se-Ho
Jeon, Seonghwan
Oh, Dan
Kim, Kilsoo
Kim, Jaechoon
Cha, Seung-Yong
Kim, Gyoungbum
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1295 - 1301
[8] Thermal-moisture Coupling Effects on PA and UF Warpage Stress of 2.5D IC Package by FE Simulation Analysis
Wang, M. H.
Wang, C. T.
Hung, C. P.
Yang, P. F.
Lee, C. C.
Wu, M. L.
2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 129 - 133
[9] Thermal management of LEDs: Package to system
Arik, M
Becker, C
Weaver, S
Petroski, J
THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 : 64 - 75
[10] CRITICAL THERMAL ISSUES IN NANOSCALE IC DESIGN
Jiang, Lei
Pantuso, Daniel
Sverdrup, Per G.
Shih, Wei-kai
2009 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, VOLS 1 AND 2, 2009, : 909 - 912

← 1 2 3 4 5 →