Effect of electron-phonon coupling on thermal transport across metal-nonmetal interface -A second look

被引:20
|
作者
Wu, Xufei [1 ]
Luo, Tengfei [1 ,2 ]
机构
[1] Univ Notre Dame, Aerosp & Mech Engn, South Bend, IN 46617 USA
[2] Univ Notre Dame, Ctr Sustainable Energy Notre Dame, South Bend, IN USA
关键词
D O I
10.1209/0295-5075/110/67004
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The effect of electron-phonon (e-ph) coupling on thermal transport across metalnonmetal interfaces is yet to be completely understood. In this paper, we use a series of molecular-dynamics (MD) simulations with e-ph coupling effect included by Langevin dynamics to calculate the thermal conductance at a model metal-nonmetal interface. It is found that while e-ph coupling can present additional thermal resistance on top of the phonon-phonon thermal resistance, it can also make the phonon-phonon thermal conductance larger than the pure phonon transport case. This is because the e-ph interaction can disturb the phonon subsystem and enhance the energy communication between different phonon modes inside the metal. This facilitates redistributing phonon energy into modes that can more easily transfer energy across the interfaces. Compared to the pure phonon thermal conduction, the total thermal conductance with e-ph coupling effect can become either smaller or larger depending on the coupling factor. This result helps clarify the role of e-ph coupling in thermal transport across metal-nonmetal interface. Copyright (C) EPLA, 2015.
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页数:6
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