A Linear InGaP/GaAs HBT Power Amplifier Using Parallel-Combined Transistors With IMD3 Cancellation

被引:24
作者
Baek, Seungjun [1 ,2 ]
Ahn, Hyunjin [1 ,2 ]
Nam, Ilku [1 ,2 ]
Ryu, Namsik [3 ]
Lee, Hui Dong [3 ]
Park, Bonghyuk [3 ]
Lee, Ockgoo [1 ,2 ]
机构
[1] Pusan Natl Univ, Dept Elect Engn, Busan, South Korea
[2] Pusan Natl Univ, PNU LG Elect Smart Control Ctr, Busan, South Korea
[3] ETRI, Mobile RF Team, Daejeon, South Korea
关键词
InGaP/GaAs HBT; parallel-combined transistors; power amplifier; small cell; third-order inter-modulation distortion (IMD3); CIRCUIT;
D O I
10.1109/LMWC.2016.2615361
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, we present a linear InGaP/GaAs HBT power amplifier (PA) with parallel-combined transistors for small-cell applications. Ballast resistors with bypass resistors and capacitors are employed in parallel-combined transistors. When the resistors and capacitors are set to appropriate values, IMD3 components of the parallel-combined transistors are found to be out of phase with each other by 180. and are canceled out at the output. The experimental results show that the proposed HBT PA with parallel-combined transistors produces a saturated output power of 33.5 dBm at 0.88 GHz, with a power-added efficiency (PAE) of 46.1% at a 5-V supply voltage. To validate the effectiveness of the proposed HBT PA for linearity improvement, the implemented PA is also tested with a long-term evolution (LTE) signal (8.1-dB PAPR with 10-MHz bandwidth). The proposed PA achieves an adjacent channel leakage ratio (ACLR) below -45 dBc at an average power of 25.6 dBm with a PAE of 18.8% without applying predistortion.
引用
收藏
页码:924 / 926
页数:3
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