Polyurethane-Modified Epoxy Resin: Solventless Preparation and Properties

被引：12
作者：
Ong, S. [1 ]
Ismail, J. [1 ]
Abu Bakar, M. [1 ]
Rahman, I. A. [1 ]
Sipaut, C. S. [1 ]
Chee, C. K. [2 ]
机构：
[1] Univ Sci Malaysia, Sch Chem Sci, George Town 11800, Malaysia
[2] Intel Technol M Sendirian Berhad, Bayan Lepas Free Trade Zone Phase 3, George Town 11900, Malaysia
来源：
JOURNAL OF APPLIED POLYMER SCIENCE | 2009年 / 111卷 / 06期
关键词：
crosslinking; polyurethanes; resins; thermal properties; thermosets; COMPOSITES; NANOCOMPOSITES; RELIABILITY; DISPERSION; PARTICLES;
D O I：
10.1002/app.29373
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
A polyurethane-modified epoxy resin system with potential as an underfill material in electronic packaging and its preparation procedure were studied. The procedure enabled the practical incorporation of an aliphatic polyurethane precursor, synthesized from poly(ethylene glycol) and hexamethylene diisocyanate without a solvent, as a precrosslinking agent into a conventional epoxy resin. With a stoichiometric quantity of the polyurethane precursor added to the epoxy (ca. 5 phr) the polyurethane-modified epoxy resin, mixed with methylene dianiline, exhibited a 36% reduction in the contact angle with the epoxy-amine surface, a 31% reduction in the cure onset temperature versus the control epoxy system, and a viscosity within the processable range. The resultant amine-cured thermosets, meanwhile, exhibited enhanced thermal stability, flexural strength, storage modulus, and adhesion strength at the expense of a 5% increase in the coefficient of thermal expansion. Exceeding the stoichiometric quantity of the polyurethane precursor, however, reduced the thermal stability and modulus but further increased the coefficient of thermal expansion. (C) 2008 Wiley Periodicals, Inc. J Appl Polym Sci 111: 3094-3103,2009
引用
收藏
页码：3094 / 3103
页数：10
相关论文
共 21 条
[1]   Synthesis and characterisation of a nematic homo-polyurethane [J].
Acierno, D ;
Amendola, E ;
Carfagna, C ;
Concilio, S ;
Iannelli, P ;
Incarnato, L ;
Scarfato, P .
POLYMER, 2003, 44 (17) :4949-4958
[2]   Thermal degradation of semi-interpenetrating polymer networks based on polyurethane and epoxy maleate of bisphenol A [J].
Cascaval, CN ;
Rosu, D ;
Rosu, L ;
Ciobanu, C .
POLYMER TESTING, 2003, 22 (01) :45-49
[3]   Studies on the properties of epoxy resins modified with chain-extended ureas [J].
He, SJ ;
Shi, KY ;
Bai, J ;
Zhang, ZK ;
Li, L ;
Du, ZJ ;
Zhang, BL .
POLYMER, 2001, 42 (23) :9641-9647
[4]   Dispersion of nanofillers in high performance polymers using reactive solvents as processing aids [J].
Jana, SC ;
Jain, S .
POLYMER, 2001, 42 (16) :6897-6905
[5]   Preparation and characterization of epoxy composites filled with functionalized nanosilica particles obtained via sol-gel process [J].
Kang, S ;
Hong, SI ;
Choe, CR ;
Park, M ;
Rim, S ;
Kim, J .
POLYMER, 2001, 42 (03) :879-887
[6]   Design and properties of UV cured polyurethane dispersions [J].
Kim, BK ;
Ahn, BU ;
Lee, MH ;
Lee, SK .
PROGRESS IN ORGANIC COATINGS, 2006, 55 (02) :194-200
[7]   Urethane oligomers as raw materials and intermediates for polyurethane elastomers.: Methods for synthesis, structural studies and analysis of chemical composition [J].
Król, P ;
Pilch-Pitera, B .
POLYMER, 2003, 44 (18) :5075-5101
[8]   Mechanical, thermal and morphological properties of water-crosslinked wood flour reinforced linear low-density polyethylene composites [J].
Kuan, Chen-Feng ;
Kuan, Hsu-Chiang ;
Ma, Chen-Chi M. ;
Huang, Chien-Ming .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2006, 37 (10) :1696-1707
[9]   Dielectric properties of three ceramic/epoxy composites [J].
Kuo, DH ;
Chang, CC ;
Su, TY ;
Wang, WK ;
Lin, BY .
MATERIALS CHEMISTRY AND PHYSICS, 2004, 85 (01) :201-206
[10]   Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications [J].
Li, Y ;
Wong, CP .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2006, 51 (1-3) :1-35
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