System-Level Simulation and Fabrication of On-Chip Fatigue Bending Test Structure for Micro-Scale Polysilicon Films

Two kind of on-chip integrated fatigue bending test structures are designed through system-level simulation method based on macromodels to measure the fracture strength and fatigue mechanical properties of polysilicon thin films. The first on-chip fatigue test structure is actuated by V-beam thermal actuator, and the other test structure actuated by electrostatic comb. The static and dynamic analysis was performed by Coventorware Architect module using self-bulid reduced order model described with the MAST hardware language and some other commercial parts from Coventorware parts library. The structural dimension parameters are determined and optimized according to system-level simulation and the computing result has shown that the self-build macromodels and the on-chip integrated test system are efficient and reliable. Two kinds of polysilicon on-chip fatigue bending test structure were fabricated with two-layer polysilicon surface micromachining process in Institute of Microelectronics, Peking University.