共 11 条
[2]
Burghartz JN, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P1015, DOI 10.1109/IEDM.1995.499389
[3]
Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates
[J].
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996,
1996,
:99-102
[5]
Kim BK, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P717, DOI 10.1109/IEDM.1995.499319
[6]
KIM YJ, 1998, IEEE T COMP PACKAG C, V21, P26
[9]
Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)
[J].
MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST,
1999,
:624-629
[10]
High-performance electroplated solenoid-type integrated inductor (SI2) for RF applications using simple 3D surface micromachining technology
[J].
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST,
1998,
:544-547