FABRICATION AND PACKAGING PROCESS OF SILICON RESONATORS CAPABLE OF THE INTEGRATION OF LSI FOR APPLICATION OF TIMING DEVICE

被引：0
|
作者：
Nguyen Van Toan [1 ]
Miyashita, Hidetoshi
Toda, Masaya [1 ]
Kawai, Yusuke [1 ]
Ono, Takahito [1 ]
机构：
[1] Tohoku Univ, Grad Sch Engn, Sendai, Miyagi 980, Japan
来源：
26TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2013) | 2013年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, silicon resonators were hermetically packaged on basis of anodic bonding of Si and LTCC (Low Temperature Co-fired ceramic) substrates. This research aims at developing the integration technology of the resonator on LSI (Large Scale Integration) for application of a timing device. The structures of the resonators were transferred onto the LTCC substrate using the anodic bonding of silicon and LTCC for electrical interconnections. Then the resonator structures were packaged hermetically by the second anodic bonding of silicon and Tempax glass for encapsulation. The device can be directly bonded to LSI.
引用
收藏
页码：377 / 380
页数：4
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