Dimensional optimization of microchannel heat sinks with multiple heat sources

被引：35

作者：

Turkakar, Goker ^{[1
]}

Okutucu-Ozyurt, Tuba ^{[1
]}

机构：

[1] Middle E Tech Univ, Dept Mech Engn, ODTU, TR-06800 Ankara, Turkey

来源：

INTERNATIONAL JOURNAL OF THERMAL SCIENCES | 2012年 / 62卷

关键词：

Microchannel heat sink; Analytical optimization; Hot spot cooling; Thermal resistance minimization; Entrance effects; Variable properties; THERMAL PERFORMANCE; NUMERICAL OPTIMIZATION;

D O I：

10.1016/j.ijthermalsci.2011.12.015

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Dimensional optimization of silicon microchannel heat sinks is performed by minimizing the total thermal resistance. Intel Core i7-900 Desktop Processor of chip core dimensions of 1.891 cm x 1.44 cm is considered as a reference processor which is reported to dissipate 130 W of heat. The properties are evaluated at the area weighted average of the fluid inlet and iteratively calculated outlet temperatures. The effects of the thermal and hydrodynamic entrance regions on heat transfer and flow are also investigated. The study is unique in that the optimization has been performed for localized multiple heat sources, as well as for a uniform heat load condition. The results of the optimization agreed very well with available ones in the literature. (C) 2011 Elsevier Masson SAS. All rights reserved.

引用

页码：85 / 92

页数：8

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