Silicon-Embedded Receiving Coil for High-Efficiency Wireless Power Transfer to Implantable Biomedical ICs

被引：38

作者：

Wu, Rongxiang ^{[1
]}

Raju, Salahuddin ^{[1
]}

Chan, Mansun ^{[1
]}

Sin, Johnny K. O. ^{[1
]}

Yue, C. Patrick ^{[1
,2
]}

机构：

[1] Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China

[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA

来源：

IEEE ELECTRON DEVICE LETTERS | 2013年 / 34卷 / 01期

关键词：

Implantable biomedical devices; monolithic inductors; wireless power transfer; DEVICES; DESIGN; LINKS;

D O I：

10.1109/LED.2012.2225135

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this letter, a silicon-embedded receiving coil is designed and fabricated for high-efficiency wireless power transfer to implantable biomedical ICs. The 4.5 mm x 4.5 mm embedded receiving coil achieved a large inductance of 4 mu H and a high peak quality factor of 20 at 2.8 MHz. Measurement results of an inductive power link using the embedded receiving coil and a conventional printed-circuit-board transmitting coil (2 cm x 2 cm) demonstrated peak voltage gains of 0.84 and 0.24 and peak efficiency values of 30% and 4.3% for separation distances of 5 and 12 mm, respectively. This is the best reported wireless power transmission efficiency for separation distance similar to the implant chip size.

引用

页码：9 / 11

页数：3

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