Analysis and Testing of a Thermoelectric Heat Exchanger Configured for Cooling a Processor Module Heat Load

被引：0

作者：

Campbell, Levi ^{[1
]}

Wright, Lloyd ^{[2
]}

机构：

[1] IBM Corp, 2455 South Rd, Poughkeepsie, NY USA

[2] Solid State Cooling Syst, Wappingers Falls, NY 12590 USA

来源：

2013 TWENTY NINTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM) | 2013年

关键词：

Thermoelectric; heat exchanger;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The testing and subsequent data analysis of a liquid to liquid thermoelectric heat exchanger configured to provide cooled water to a heat load are discussed in the following paper. In the test apparatus, water flow rates and temperatures are recorded. From previously obtained heat transfer data for each heat exchanger plate, and from previous thermoelectric heat exchanger analysis work by Campbell et al. [1] and Luo [2], a model is developed and fit to the current data. Various scenarios are then developed to explore the performance of the thermoelectric heat exchanger in multiple operating modes.

引用

页码：93 / 98

页数：6