Laser application to IC correction.

被引：0

作者：

Novoselov, AR ^{[1
]}

机构：

[1] Russian Acad Sci, Inst Semicond Phys, Novosibirsk 630090, Russia

来源：

WORLD MULTICONFERENCE ON SYSTEMICS, CYBERNETICS AND INFORMATICS, VOL XVII, PROCEEDINGS: CYBERNETICS AND INFORMATICS: CONCEPTS AND APPLICATIONS (PT II) | 2001年

关键词：

SCI; laser; Integrated Circuits; semiconductor materials; laser cutting; laser drilling;

D O I：

暂无

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

The physical problems in application of laser technologies for correction of Integrated Circuits (IC) and way of their solution are presented. The presence of an electronic component defining area of a degradation of the materials surrounding laser cavity, considerably limits application of femto-second laser and of ion beams for operation with semiconductor materials. On the basis of experimental data is shown, that there are reason for correction of basic formulas, which uses for calculation the laser-material interaction.

引用

页码：459 / 463

页数：5

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