Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging

被引：14
作者：
Jing, Hongyang [1 ,2 ]
Li, Yuan [1 ,2 ]
Xu, Lianyong [1 ,2 ]
Han, Yongdian [1 ,2 ]
Lu, Guoquan [1 ,2 ]
Zhang, Hao [1 ,2 ]
机构：
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
[2] Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China
来源：
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE | 2015年 / 24卷 / 12期
基金：
中国国家自然科学基金; 高等学校博士学科点专项科研基金;
关键词：
interfacial reaction; Ni diffusion barrier layer; reliability; SAC305; thermoelectric device; THERMOELECTRIC-MATERIALS; DIFFUSION; BISMUTH; NI; CONTACTS; SOLDER; COPPER;
D O I：
10.1007/s11665-015-1809-2
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
As a diffusion barrier layer, Ni is widely applied in power electronics packaging, especially in thermoelectric devices. This paper presents the variation of Ni diffusion barrier layer during aging and failure mechanisms of thermoelectric device joints. The thermoelectric joint consists of Sn96.5Ag3.0Cu0.5 (SAC305) solder and Bi2Te3-based thermoelectric materials such as Bi0.5Sb1.5Te3 and Bi1.8Sb0.2Se0.15Te2.85 during service. The result shows that with the increasing aging time, Ni layer was constantly consumed by SAC305 and Bi2Te3-based thermoelectric materials simultaneously. The reaction products are (Cu,Ni)(6)Sn-5 and NiTe or Ni(Bi,Te), respectively. Besides, the shear strength of SAC305/Bi0.5Sb1.5Te3 joint or SAC305/Bi1.8Sb0.2Se0.15Te2.85 joint gets gradually decreased and thermoelectric conversion performance gets worse. Meantime, the different failure mechanisms are also compared between SAC305/Bi0.5Sb1.5Te3 couple joints and SAC305/Bi1.8Sb0.2Se0.15Te2.85 couple joints.
引用
收藏
页码：4844 / 4852
页数：9
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