共 15 条
[1]
Auth C., 2008, 2008 Symposium on VLSI Technology, P128, DOI 10.1109/VLSIT.2008.4588589
[3]
George V, 2007, IEEE ASIAN SOLID STA, P14
[5]
Reducing variation in advanced logic technologies: Approaches to process and design for manufacturability of nanoscale CMOS
[J].
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2,
2007,
:471-474
[6]
Min KS, 2003, ISLPED'03: PROCEEDINGS OF THE 2003 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, P66
[7]
A 45nm logic technology with high-k plus metal gate transistors, strained silicon, 9 Cu interconnect layers, 193nm dry patterning, and 100% Pb-free packaging
[J].
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2,
2007,
:247-+
[8]
MIYAZAKI M, 2000, ISSCC, P420
[9]
SAKRAN N, 2007, IEEE INT SOL STAT CI, P106