A 3.8 GHz 153 Mb SRAM Design With Dynamic Stability Enhancement and Leakage Reduction in 45 nm Hi-k Metal Gate CMOS Technology

被引:24
作者
Hamzaoglu, Fatih [1 ]
Zhang, Kevin [1 ]
Wang, Yih [1 ]
Ahn, Hong Jo [1 ]
Bhattacharya, Uddalak [1 ]
Chen, Zhanping [1 ]
Ng, Yong-Gee [1 ]
Pavlov, Andrei [1 ]
Smits, Ken [2 ]
Bohr, Mark [1 ]
机构
[1] Intel Corp, Hillsboro, OR 97124 USA
[2] Intel Corp, Santa Clara, CA 95054 USA
关键词
Forward-body-bias; high-speed; leakage reduction; low-power; sleep transistor; Static-random-access-memory (SRAM); FLUCTUATIONS;
D O I
10.1109/JSSC.2008.2007151
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high-performance low-power 153 Mb SRAM is developed in 45 nm high-k Metal Gate technology. Dynamic SRAM PMOS forward-body-bias (FBB) and Active-Controlled SRAM VCC in Sleep are integrated in the design to lower Active-VCCmin and Standby Leakage, respectively. FBB improves the Active-VCCmin by up to 75 mV, and Active-Controlled SRAM VCC distribution tightened by 100 mV, both of which result in further power reduction. A 0.346 mu m(2) 6T-SRAM bit-cell is used which is optimized for VCCmin, performance, leakage and area. The design operates at high-speed over a wide voltage range, and has a maximum frequency of 3.8 GHz at 1.1 V. The 16 KB Subarray was also used as the building block in on-die 6 MB Cache for Intel Core 2 Duo CPU in 45 nm technology.
引用
收藏
页码:148 / 154
页数:7
相关论文
共 15 条
[1]  
Auth C., 2008, 2008 Symposium on VLSI Technology, P128, DOI 10.1109/VLSIT.2008.4588589
[2]   The impact of intrinsic device fluctuations on CMOS SRAM cell stability [J].
Bhavnagarwala, AJ ;
Tang, XH ;
Meindl, JD .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2001, 36 (04) :658-665
[3]  
George V, 2007, IEEE ASIAN SOLID STA, P14
[4]   A 256-Kb dual-VCC SRAM building block in 65-nm CMOS process with actively clamped sleep transistor [J].
Khellah, Muhammad ;
Somasekhar, Dinesh ;
Ye, Yibin ;
Kim, Nam Sung ;
Howard, Jason ;
Ruhl, Greg ;
Sunna, Murad ;
Tschanz, James ;
Borkar, Nitin ;
Hamzaoglu, Fatih ;
Pandya, Gunjan ;
Farhang, Ali ;
Zhang, Kevin ;
De, Vivek .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2007, 42 (01) :233-242
[5]   Reducing variation in advanced logic technologies: Approaches to process and design for manufacturability of nanoscale CMOS [J].
Kuhn, Kelin J. .
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, :471-474
[6]  
Min KS, 2003, ISLPED'03: PROCEEDINGS OF THE 2003 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, P66
[7]   A 45nm logic technology with high-k plus metal gate transistors, strained silicon, 9 Cu interconnect layers, 193nm dry patterning, and 100% Pb-free packaging [J].
Mistry, K. ;
Allen, C. ;
Auth, C. ;
Beattie, B. ;
Bergstrom, D. ;
Bost, M. ;
Brazier, M. ;
Buehler, M. ;
Cappellani, A. ;
Chau, R. ;
Choi, C. -H. ;
Ding, G. ;
Fischer, K. ;
Ghani, T. ;
Grover, R. ;
Han, W. ;
Hanken, D. ;
Hatttendorf, M. ;
He, J. ;
Hicks, J. ;
Huessner, R. ;
Ingerly, D. ;
Jain, P. ;
James, R. ;
Jong, L. ;
Joshi, S. ;
Kenyon, C. ;
Kuhn, K. ;
Lee, K. ;
Liu, H. ;
Maiz, J. ;
McIntyre, B. ;
Moon, P. ;
Neirynck, J. ;
Pei, S. ;
Parker, C. ;
Parsons, D. ;
Prasad, C. ;
Pipes, L. ;
Prince, M. ;
Ranade, P. ;
Reynolds, T. ;
Sandford, J. ;
Schifren, L. ;
Sebastian, J. ;
Seiple, J. ;
Simon, D. ;
Sivakumar, S. ;
Smith, P. ;
Thomas, C. .
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, :247-+
[8]  
MIYAZAKI M, 2000, ISSCC, P420
[9]  
SAKRAN N, 2007, IEEE INT SOL STAT CI, P106
[10]   STATIC-NOISE MARGIN ANALYSIS OF MOS SRAM CELLS [J].
SEEVINCK, E ;
LIST, FJ ;
LOHSTROH, J .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1987, 22 (05) :748-754