Thermal Diffusivity of Hexagonal Boron Nitride Composites Based on Cross-Linked Liquid Crystalline Polyimides

被引:25
作者
Shoji, Yu [1 ]
Higashihara, Tomoya [1 ,2 ]
Tokita, Masatoshi [1 ]
Morikawa, Junko [1 ]
Watanabe, Junji [1 ]
Ueda, Mitsuru [1 ]
机构
[1] Tokyo Inst Technol, Grad Sch Sci & Engn, Dept Organ & Polymer Mat, Meguro Ku, Tokyo 1528550, Japan
[2] Japan Sci & Technol Agcy JST, PRESTO, Kawaguchi, Saitama 3320012, Japan
基金
日本学术振兴会;
关键词
liquid crystalline polyimide; cross-link; siloxane unit; hexagonal boron nitride; composite; thermal diffusivity; POLYMER COMPOSITES; CONDUCTIVITY; TRANSPORT; FILMS;
D O I
10.1021/am400460p
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Hexagonal boron nitride (h-BN) composites with the oriented cross-linked liquid crystalline (LC) polyimide have been developed as high thermally conductive materials. Well-dispersed h-BN composite films were obtained, as observed by scanning electron microscopy. The morphology of the composite films was further investigated in detail by the wide-angle X-ray diffraction. The obtained composite films based on the cross-linked LC polyimide showed that the polymer chains vertically aligned in the direction parallel to the films, while those based on the amorphous polyimide showed an isotropic nature. Moreover, the alignment of the crosslinked LC polyimides was maintained, even after increasing the volume fraction of h-BN. This alignment plays an important role in the effective phonon conduction between h-BN and the matrices. Indeed, the thermal diffusivity in the thickness direction of the composite films based on the LC polyimide measured by a temperature wave analysis method was increased to 0.679 mm(2) s(-1) at a 30 vol % h-BN loading, which was higher than that based on the amorphous polyimide.
引用
收藏
页码:3417 / 3423
页数:7
相关论文
共 31 条
  • [1] Study of high thermal conductive epoxy resins containing controlled high-order structures
    Akatsuka, M
    Takezawa, Y
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2003, 89 (09) : 2464 - 2467
  • [2] Superior thermal conductivity of single-layer graphene
    Balandin, Alexander A.
    Ghosh, Suchismita
    Bao, Wenzhong
    Calizo, Irene
    Teweldebrhan, Desalegne
    Miao, Feng
    Lau, Chun Ning
    [J]. NANO LETTERS, 2008, 8 (03) : 902 - 907
  • [4] Materials for thermal conduction
    Chung, DDL
    [J]. APPLIED THERMAL ENGINEERING, 2001, 21 (16) : 1593 - 1605
  • [5] Thermal conductivity of exfoliated graphite nanocomposites
    Fukushima, H.
    T Drzal, L.
    Rook, B. P.
    Rich, M. J.
    [J]. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2006, 85 (01) : 235 - 238
  • [6] Effects of carbon fillers on the thermal conductivity of highly filled liquid-crystal polymer based resins
    Hauser, Rebecca A.
    King, Julia A.
    Pagel, Rachel M.
    Keith, Jason M.
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2008, 109 (04) : 2145 - 2155
  • [7] Thermal conductivity of platelet-filled polymer composites
    Hill, RF
    Supancic, PH
    [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2002, 85 (04) : 851 - 857
  • [8] Characteristic smectic structures of main-chain liquid-crystalline polyimides driven by a microphase separation between aromatic imide mesogen and a siloxane spacer
    Ishige, Ryohei
    Shoji, Yu
    Higashihara, Tomoya
    Ueda, Mitsuru
    Watanabe, Junji
    [J]. JOURNAL OF MATERIALS CHEMISTRY, 2012, 22 (04) : 1532 - 1538
  • [9] Thermal conductivity models for Carbon/Liquid crystal polymer composites
    Keith, Jason M.
    King, Julia A.
    Lenhart, Kara M.
    Zimny, Bridget
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2007, 105 (06) : 3309 - 3316
  • [10] Thermal transport measurements of individual multiwalled nanotubes
    Kim, P
    Shi, L
    Majumdar, A
    McEuen, PL
    [J]. PHYSICAL REVIEW LETTERS, 2001, 87 (21) : 215502 - 1