Package-on-Package for Chip Cooling with Embedded Fluidics

被引：0
|
作者：
Chua, Tiffany [1 ]
Babikian, Sarkis [1 ]
Wu, Liang [1 ]
Li, G. -P. [1 ]
Bachman, Mark [1 ]
机构：
[1] Univ Calif Irvine, Irvine, CA 92697 USA
来源：
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年
关键词：
HEAT-TRANSFER; CONVECTION; MICROCHANNELS; FLOW;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm(2). Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a "package-on-package" construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
引用
收藏
页码：1605 / 1612
页数：8
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