Package-on-Package for Chip Cooling with Embedded Fluidics

被引：0
|
作者：
Chua, Tiffany [1 ]
Babikian, Sarkis [1 ]
Wu, Liang [1 ]
Li, G. -P. [1 ]
Bachman, Mark [1 ]
机构：
[1] Univ Calif Irvine, Irvine, CA 92697 USA
来源：
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年
关键词：
HEAT-TRANSFER; CONVECTION; MICROCHANNELS; FLOW;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm(2). Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a "package-on-package" construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
引用
收藏
页码：1605 / 1612
页数：8
相关论文
共 50 条
  • [1] Intelligent cooling of a telecommunication electronic package
    Abakr, YA
    Ismail, AF
    Ahmed, MI
    4TH NATIONAL CONFERENCE ON TELECOMMUNICATION TECHNOLOGY, PROCEEDINGS, 2003, : 185 - 188
  • [2] Forced-convective cooling of citrus fruit: Package design
    Defraeye, Thijs
    Lambrecht, Rutger
    Tsige, Alemayehu Ambaw
    Delele, Mulugeta Admasu
    Opara, Umezuruike Linus
    Cronje, Paul
    Verboven, Pieter
    Nicolai, Bart
    JOURNAL OF FOOD ENGINEERING, 2013, 118 (01) : 8 - 18
  • [3] Thermal conduction analysis and characterization of solder bumps in flip chip package
    Lu, Xiangning
    Shi, Tielin
    Xia, Qi
    Liao, Guanglan
    APPLIED THERMAL ENGINEERING, 2012, 36 : 181 - 187
  • [4] Investigation on Embedded Microchannel Heatsink for 2.5-D Integrated Package
    Zhang, Peng
    Wang, Da-Wei
    Zhao, Wen-Sheng
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (06): : 838 - 848
  • [5] Experimental Investigation of Direct Liquid Cooling of a Two-Die Package
    Ramakrishnan, Bharath
    Alkharabsheh, Sami
    Hadad, Yaser
    Chiarot, Paul R.
    Ghose, Kanad
    Sammakia, Bahgat
    Gektin, Vadim
    Chao, Wang
    PROCEEDINGS 2018 34TH ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT, MODELLING & MANAGEMENT SYMPOSIUM (SEMI-THERM), 2018, : 42 - 49
  • [6] Forced-air cooling of polylined horticultural produce: Optimal cooling conditions and package design
    O'Sullivan, Justin L.
    Ferrua, Maria J.
    Love, Richard
    Verboven, Pieter
    Nicolai, Bart
    East, Andrew
    POSTHARVEST BIOLOGY AND TECHNOLOGY, 2017, 126 : 67 - 75
  • [7] Package-Level Integration of Liquid Cooling Technology with Microchannel IHS for High Power Cooling
    Chang, Je-Young
    Kulkarni, Devdatta
    Mahajan, Ravi
    Jorgensen, Michael
    Neal, Nick
    Dischler, Rich
    Dasu, Aravind
    Ahuja, Sandeep
    Mongia, Rajiv
    PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), 2021, : 18 - 23
  • [8] Forced-convective cooling of citrus fruit: Cooling conditions and energy consumption in relation to package design
    Defraeye, Thijs
    Lambrecht, Rutger
    Delele, Mulugeta Admasu
    Tsige, Alemayehu Ambaw
    Opara, Umezuruike Linus
    Cronje, Paul
    Verboven, Pieter
    Nicolai, Bart
    JOURNAL OF FOOD ENGINEERING, 2014, 121 : 118 - 127
  • [9] Experimental study on the application of paraffin slurry to high density electronic package cooling
    K. Cho
    M. Choi
    Heat and Mass Transfer, 2000, 36 : 29 - 36
  • [10] Metal Additive Microfabrication of System-in-Package with Embedded Microfluidic Thermal Management for Heterogeneous Integration with Semiconductor Dies
    Lohani, Bhushan
    Hossain, Sheikh Dobir
    Roberts, Robert C.
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (05) : 2940 - 2950
12345