Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate

被引：16

作者：

Zou, H. F. ^{[1
]}

Zhang, Z. F. ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 469卷 / 1-2期

关键词：

Ag single crystal substrate; Lead-free solder; Intermetallic compounds (IMCs); Growth kinetics; Local cracks; LEAD-FREE SOLDERS; INTERMETALLIC COMPOUND; CU-SN; NI; BI; MICROSTRUCTURE; METALLIZATION; WT.PERCENT; STRENGTH; GROWTH;

D O I：

10.1016/j.jallcom.2008.01.082

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Growth kinetics and interfacial morphologies of the intermetallic compounds (IMCs) between single crystal Ag and Sn-4Ag, Sn-3Cu and Sn-37Pb solders were investigated by solid-state aging at 160 degrees C and liquid-state aging at 260 degrees C. Isothermal equation of chemical reaction and phase diagrams were used to explain the effects of Ag, Cu and Pb on the growth kinetics of IMCs under solid-state and liquid-state aging conditions. The diffusion coefficients for the three solder joints of Sn-4Ag/Ag, Sn-3Cu/Ag and Sn-37Pb/Ag were calculated after solid-state and liquid-state aging. It is found that Pb can effectively retard the growth of IMCs during liquid-state aging but has little influence on the growth rate of IMCs during the solid-state aging. Some local small cracks were frequently observed in the Cu6Sn5 particles near interfaces of the Sn-3Cu/Ag solder joints after solid-state aging for several days. However, there were no such local small cracks when solders or interfaces did not contain the Cu6Sn5 particles after the same aging time. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：207 / 214

页数：8

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